Screening methodology to eliminate wire sweep in bond and assembly module packaging

ABSTRACT

Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.13/834,039, filed on Mar. 15, 2013 and titled “Screening Methodology ToEliminate Wire Sweep In Bond And Assembly Module Packaging,” nowpending, which is hereby incorporated by reference.

BACKGROUND Technical Field

The present embodiments relates generally to electronic module testing.More specifically, the embodiments relates to a process for efficienttesting of the modules for a wire sweep.

Background

In bond and assembly of an electronic package or module, wires arebonded to a die and finger on a laminate. These wires serve to connectthe die to the outer laminate, enabling the function of the module at anassociated card attachment location.

Electronic modules however, may be defective as a result of a variety ofmanufacturing defects. One such defect is known as a wire sweep, whereinthe wires of the module are not properly aligned. Misalignment of thewires may cause a short and may be detectable prior to the short. Whiletesting for wires that are in physical contact is somewhat rudimentary,wires that are close together, yet not in contact, do not fail thisshorting test and are therefore more difficult to detect. One solutionis to use an x-ray to detect a wire sweep. However, this process isexpensive, making the X-ray screening of many modules undesirable.

SUMMARY

The embodiments include a method, system, and computer program productfor efficiently testing electronic modules for a defect.

In one aspect, a method is provided for performing a quality controlreview of electronic modules. Individual modules include a functionalassembly of electrical components. A first test is performed on a firstbatch of modules to detect a gross failure associated with the modules.Similarly, a second test is performed on failed modules of the firsttest. The second test is an electromagnetic imaging test of one or morewires in the electronic module. A third test is performed on modulesthat pass the second test. The third test comprising is an electroniccurrent leakage screening.

In another aspect, a computer program product is provided to performquality review of electronic modules. The computer program product is incommunication with a computer-readable hardware storage device havingcomputer readable program code embodied therewith. When executed, thecomputer implements testing on the electronic modules. First, second,and third tests are performed. More specifically, the first test isperformed on a first batch of the modules to detect a gross failure. Thesecond test is performed on failed modules of the first test, with thesecond test being an electromagnetic imaging test. The third test isperformed on modules that pass the second test, with the third testbeing an electronic current leakage screening.

In yet another aspect, a system is provided to perform quality controlreview on one or more electronic modules. The system includes aprocessing unit provided in communication with memory. One or more toolsare provided to perform a quality control review of the electronicmodules in a batch, with each module being a functional assembly ofelectronic components. A test manager and a screening manager areprovided. The test manager performs a first test and a second test. Thefirst test is performed on a first batch of the modules, and functionsto detect a gross failure associated with the modules. The second testis performed on failed modules of the first test. The second test is anelectromagnetic image test on one or more wires in the electronicmodule(s). Finally, a third test is performed by the screening managerfor modules that pass the second test. The third test is in the form ofan electronic current leakage screening.

Other features and advantages of these embodiments will become apparentfrom the following detailed description of the presently preferredembodiments, taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings referenced herein form a part of the specification.Features shown in the drawings are meant as illustrative of only someembodiments, and not of all embodiments unless otherwise explicitlyindicated. Implications to the contrary are otherwise not to be made.

FIG. 1 is a flow chart illustrating a method for a first and secondphase of a first module test.

FIG. 2 is a flow chart illustrating a method for a second module test.

FIG. 3 depicts a block diagram of a system for electronic module qualityassurance testing.

FIG. 4 depicts a block diagram showing a system for implementing anembodiment.

DETAILED DESCRIPTION

It will be readily understood that the components of the presentembodiments, as generally described and illustrated in the Figuresherein, may be arranged and designed in a wide variety of differentconfigurations. Thus, the following detailed description of theembodiments of the apparatus, system, and method of the presentembodiments, as presented in the Figures, is not intended to limit thescope of the embodiments, as claimed, but is merely representative ofselected embodiments.

The functional unit described in this specification has been labeledwith tools, modules, and/or managers. The functional unit may beimplemented in programmable hardware devices such as field programmablegate arrays, programmable array logic, programmable logic devices, orthe like. The functional unit may also be implemented in software forexecution by various types of processors. An identified functional unitof executable code may, for instance, comprise one or more physical orlogical blocks of computer instructions which may, for instance, beorganized as an object, procedure, function, or other construct.Nevertheless, the executable of an identified functional unit need notbe physically located together, but may comprise disparate instructionsstored in different locations which, when joined logically together,comprise the functional unit and achieve the stated purpose of thefunctional unit.

Indeed, a functional unit of executable code could be a singleinstruction, or many instructions, and may even be distributed overseveral different code segments, among different applications, andacross several memory devices. Similarly, operational data may beidentified and illustrated herein within the functional unit, and may beembodied in any suitable form and organized within any suitable type ofdata structure. The operational data may be collected as a single dataset, or may be distributed over different locations including overdifferent storage devices, and may exist, at least partially, aselectronic signals on a system or network.

Reference throughout this specification to “a select embodiment,” “oneembodiment,” or “an embodiment” means that a particular feature,structure, or characteristic described in connection with the embodimentis included in at least one embodiment of the present embodiments. Thus,appearances of the phrases “a select embodiment,” “in one embodiment,”or “in an embodiment” in various places throughout this specificationare not necessarily referring to the same embodiment.

Furthermore, the described features, structures, or characteristics maybe combined in any suitable manner in one or more embodiments. In thefollowing description, numerous specific details are provided, such asexamples of managers, to provide a thorough understanding ofembodiments. One skilled in the relevant art will recognize, however,that the embodiments can be practiced without one or more of thespecific details, or with other methods, components, materials, etc. Inother instances, well-known structures, materials, or operations are notshown or described in detail to avoid obscuring aspects of theembodiments.

The illustrated embodiments will be best understood by reference to thedrawings, wherein like parts are designated by like numerals throughout.The following description is intended only by way of example, and simplyillustrates certain selected embodiments of devices, systems, andprocesses that are consistent with the embodiments as claimed herein.

In the following description of the embodiments, reference is made tothe accompanying drawings that form a part hereof, and which shows byway of illustration the specific embodiment(s) which may be practiced.It is to be understood that other embodiments may be utilized becausestructural changes may be made without departing from the scope of thepresent embodiments.

In order to maximize efficiency of module testing, multiple tests may beemployed, in which further assessments are reserved for a smaller batchof modules for improved testing efficiency. FIG. 1 is a flow chart (100)illustrating a method for a first set of testing that employs at leasttwo such tests for assessing the modules. Initially, a first test ofmodule testing is employed on a batch of modules (102). This first test,also referred to as a first phase, is employed to detect a gross failureassociated with modules within the batch. A failure rate is determinedfrom the first test, and it is determined if this failure rate isgreater than a first threshold (104). A negative response is anindication the batch, or a significant portion of the modules in thebatch has passed the first test in the assessment and in one embodiment,the batch is designated for shipment (106). Accordingly, the first testdetermines an initial disposition lot.

A positive response to the determination at step (104) is an indicationthat there is a detected defect within at least some of the testedmodule(s) of the batch. In one embodiment, the detected defect is anindication of a high occurrence of a short or shorting defect in thebatch. This detection is an indication that it might be a wire sweepsince there is the indication of a possible shorting defect in thebatch. The number of failed modules is assigned to the variable,X_(total) (108). In addition, a counting variable x is initialized forthe failed modules (110), and a counting variable y is initialized tocount modules (112). A second test in the form of an x-ray wire sweep isperformed on failed module (114). From this testing, it is determined ifthe module has a wire sweep deficiency (116). In one embodiment, thewire sweep is a misalignment of one or more wires in an electronicmodule. A negative response to step (116) is followed by designating themodule, module for an additional assessment (118) followed byincrementing the variable x (120). Any module determined to have failedthe first test but does not have evidence of a wire sweep is indicativeof a different problem that requires further failure analysis.Conversely, a positive response to the determination at step (116) isfollowed by an increment of the variable y (122). For each moduledetermined to have a wire sweep deficiency, it is determined if thepercentage of modules with wire sweeps is greater than a definedthreshold (124). The threshold analysis at step (124) provides anindicator on which modules to carry out additional analysis. A positiveresponse is followed by evidence of a wire sweep in the failed lot ofthe first testing phase (126). Conversely, a negative response to thedetermination at step (124) is followed by an increment of the modulecounting variable, x, (120) and determining if a detailed failureanalysis has been performed on a large or significant quantity of failedmodules for the failed lot of the first test (130). In one embodiment,the determination at step (130) is subjective. A negative response tothe determination at step (130) is followed by a return to step (114),and a positive response is followed by a return to step (106).

A second set of testing is limited to modules that have passed the firstset of testing. FIG. 2 is a flow chart (200) illustrating a method forthe second set of testing which pertains to assessing current leakage inthe individual modules. This second set of testing, like the first setof testing, includes two parts. The variable N_(Total) is assigned tothe number of original modules in the batch (202) and the variableX_(Total) is assigned to the number of failed modules from the first setof testing (204). The variable M_(Total) is defined as the differencebetween N_(Total) and X_(Total) (206). The counting variable M isinitialized (208), and a current leakage test is performed on module_(M)at a first leakage limit (210). Accordingly, each module_(M) is testedfor current leakage up to a specified current leakage limit.

Following the current leakage test at step (210), it is determinedwhether the module, module_(M), failed the current leakage limit test(212). A negative response is followed by updating the database recordsof the results and designating the passed module for shipment (214).Conversely, a positive response to the determination at step (212)designates the failed module to be scrapped or otherwise disposed (216).Following either step (214) or (216), the counting variable M isincremented for testing of additional modules (218) and it is determinedwhether each module designated for the current leakage test has beenassessed (220). A negative response to the determination at step (220)is followed by a return to step (210), and a positive response isfollowed by a termination of the method. Accordingly, each module thatdid not fail the first test shown in FIG. 1 is tested for excessivecurrent leakage.

As will be appreciated by one skilled in the art, aspects of the presentembodiments may be embodied as a system, method or computer programproduct. Accordingly, aspects of the present embodiments may take theform of an entirely hardware based embodiment, an entirely softwarebased embodiment (including firmware, resident software, micro-code,etc.) or an embodiment combining software and hardware aspects that mayall generally be referred to herein as a “circuit,” “module” or“system.” Furthermore, aspects of the present embodiments may take theform of a computer program product embodied in one or more computerreadable medium(s) having computer readable program code embodiedthereon.

Any combination of one or more computer readable medium(s) may beutilized. The computer readable medium may be a computer readable signalmedium or a computer readable storage medium. A computer readablestorage medium may be, for example, but not limited to, an electronic,magnetic, optical, electromagnetic, infrared, or semiconductor system,apparatus, or device, or any suitable combination of the foregoing. Morespecific examples (a non-exhaustive list) of the computer readablestorage medium would include the following: an electrical connectionhaving one or more wires, a portable computer diskette, a hard disk, arandom access memory (RAM), a read-only memory (ROM), an erasableprogrammable read-only memory (EPROM or Flash memory), an optical fiber,a portable compact disc read-only memory (CD-ROM), an optical storagedevice, a magnetic storage device, or any suitable combination of theforegoing. In the context of this document, a computer readable storagemedium may be any tangible medium that can contain, or store a programfor use by or in connection with an instruction execution system,apparatus, or device.

A computer readable signal medium may include a propagated data signalwith computer readable program code embodied therein, for example, inbaseband or as part of a carrier wave. Such a propagated signal may takeany of a variety of forms, including, but not limited to,electro-magnetic, optical, or any suitable combination thereof. Acomputer readable signal medium may be any computer readable medium thatis not a computer readable storage medium and that can communicate,propagate, or transport a program for use by or in connection with aninstruction execution system, apparatus, or device.

Program code embodied on a computer readable medium may be transmittedusing any appropriate medium, including but not limited to wireless,wire line, optical fiber cable, RF, etc., or any suitable combination ofthe foregoing.

Computer program code for carrying out operations for aspects of thepresent embodiments may be written in any combination of one or moreprogramming languages, including an object oriented programming languagesuch as Java, Smalltalk, C++ or the like and conventional proceduralprogramming languages, such as the “C” programming language or similarprogramming languages. The program code may execute entirely on theuser's computer, partly on the user's computer, as a stand-alonesoftware package, partly on the user's computer and partly on a remotecomputer or entirely on the remote computer or server. In the latterscenario, the remote computer may be connected to the user's computerthrough any type of network, including a local area network (LAN) or awide area network (WAN), or the connection may be made to an externalcomputer (for example, through the Internet using an Internet ServiceProvider).

Aspects of the present embodiments are described above with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems) and computer program products according to the embodiments. Itwill be understood that each block of the flowchart illustrations and/orblock diagrams, and combinations of blocks in the flowchartillustrations and/or block diagrams, can be implemented by computerprogram instructions. These computer program instructions may beprovided to a processor of a general purpose computer, special purposecomputer, or other programmable data processing apparatus to produce amachine, such that the instructions, which execute via the processor ofthe computer or other programmable data processing apparatus, createmeans for implementing the functions/acts specified in the flowchartand/or block diagram block or blocks.

These computer program instructions may also be stored in a computerreadable medium that can direct a computer, other programmable dataprocessing apparatus, or other devices to function in a particularmanner, such that the instructions stored in the computer readablemedium produce an article of manufacture including instructions whichimplement the function/act specified in the flowchart and/or blockdiagram block or blocks.

The computer program instructions may also be loaded onto a computer,other programmable data processing apparatus, or other devices to causea series of operational steps to be performed on the computer, otherprogrammable apparatus or other devices to produce a computerimplemented process such that the instructions which execute on thecomputer or other programmable apparatus provide processes forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks.

A system is also provided for implementing the electronic module testingmethod as described above. FIG. 3 is a block diagram (300) illustratinga system for module testing. A computer is provided (302) having aprocessing unit (304) in communication with memory (306) across a bus(308). A functional unit (310) is provided in communication with memory(306) having tools for implementation of module testing. The toolsprovided include, but are not limited to: a test manager (312), ascreening manager (316), and in one embodiment a modification manager(318). Accordingly, a computer is provided with a functional unit havingtools for the automation of module testing.

As the electronic module(s) (330) advance through a testing location(350), a first test (322) is performed on the electronic module(s) todetermine if the electronic module(s) (330) experience any grossfailure. The first test (322), as implemented by the test manager (312),assesses a batch of modules for any significant or gross defects, suchas shorting. Modules determined to have passed the first test (322) areredirected to a location (352) for shipment away from the testinglocation (350). The test manager (312) performs a failure rate analysisfor the modules subject to the first test (322). If the failure ratedoes not exceed a threshold, e.g. the modules passed the initialassessment; the modules subject to the first test (322) passed the firsttest (322) in the module assessment process. In one embodiment, thepassed modules may be designated for shipment. Accordingly, the testmanager (312) assesses an initial disposition of the modules.

However, if the test manager (312) assesses a failure rate based on thethreshold assessment, then there is a detected defect within at leastone or more tested modules. In one embodiment, identification of adefect is an indication of a high occurrence of a short or shortingdefect. One such possible defect is a wire sweep. A second test (324) inthe form of an x-ray wire sweep is performed on one or more of thefailed modules from the first test (324). From this testing, it isdetermined if the module has a wire sweep deficiency. In one embodiment,the test manager (312) manages the x-ray of the failed modules. The testmanager (312) assesses if a percentage of modules with a wire sweep isgreater than a defined threshold. This threshold analysis provides anindicator as to which modules additional analysis should be carried out.

A screening manager (316) is provided in communication with the firsttest manager (312) and performs an electronic current leakage screening(326) for modules that passed the first test (322), and in oneembodiment, the current leakage screening test is performed on modulesthat passed the wire sweep assessment and have been determined not tocontain a wire sweep defect. In one embodiment, the modification manager(318) is provided in communication with the screening manager (316). Themodification manager (318) establishes an electric current leakagesetting for the screening manager (316). In one embodiment, themodification manager (318) modifies the current leakage setting,including a reduced leakage setting or an increased leakage setting. Inone embodiment, the select grouping module(s) are tested twice by thescreening manager (316), wherein the second time the module(s) aretested, the current leakage setting on the module(s) is adjusted by themodification manager (318). The screening manager (316) may individuallyeliminate modules that have failed the current leakage screening. In oneembodiment, the screening manager (316) may replace the wire sweep froma population of non-failed modules with the screening for currentleakage. Accordingly, the screening manager (316) performs a currentleakage screening test, and the modification manager (318) sets and/oradjusts the electric current leakage setting to further assess currentleakage in the select grouping of modules.

Referring now to the block diagram of FIG. 4, additional details are nowdescribed with respect to implementing at least one of the embodiments.The computer system includes one or more processors, such as a processor(402). The processor (402) is connected to a communicationinfrastructure (404) (e.g., a communications bus, cross-over bar, ornetwork).

The computer system can include a display interface (406) that forwardsgraphics, text, and other data from the communication infrastructure(404) (or from a frame buffer not shown) for display on a display unit(408). The computer system also includes a main memory (410), preferablyrandom access memory (RAM), and may also include a secondary memory(412). The secondary memory (412) may include, for example, a hard diskdrive (414) and/or a removable storage drive (416), representing, forexample, a floppy disk drive, a magnetic tape drive, or an optical diskdrive. The removable storage drive (416) reads from and/or writes to aremovable storage unit (418) in a manner well known to those havingordinary skill in the art. Removable storage unit (418) represents, forexample, a floppy disk, a compact disc, a magnetic tape, or an opticaldisk, etc., which is read by and written to a removable storage drive(416). As will be appreciated, the removable storage unit (418) includesa computer readable medium having stored therein computer softwareand/or data.

In alternative embodiments, the secondary memory (412) may include othersimilar means for allowing computer programs or other instructions to beloaded into the computer system. Such means may include, for example, aremovable storage unit (420) and an interface (422). Examples of suchmeans may include a program package and package interface (such as thatfound in video game devices), a removable memory chip (such as an EPROM,or PROM) and associated socket, and other removable storage units (420)and interfaces (422) which allow software and data to be transferredfrom the removable storage unit (420) to the computer system.

The computer system may also include a communications interface (424). Acommunications interface (424) allows software and data to betransferred between the computer system and external devices. Examplesof a communication interface (424) may include a modem, a networkinterface (such as an Ethernet card), a communications port, or a PCMCIAslot and card, etc. Software and data transferred via a communicationinterface (424) is in the form of signals which may be, for example,electronic, electromagnetic, optical, or another signal capable of beingreceived by communications interface (424). These signals are providedto communications interface (424) via a communications path (i.e.,channel) (426). This communications path (426) carries signals and maybe implemented using wire or cable, fiber optics, a phone line, acellular phone link, a radio frequency (RF) link, and/or othercommunication channels.

In this document, the terms “computer program medium,” “computer usablemedium,” and “computer readable medium” are used to generally refer tomedia such as main memory (410) and secondary memory (412), removablestorage drive (416), and a hard disk installed in a hard disk drive(414).

Computer programs (also called computer control logic) are stored inmain memory (410) and/or secondary memory (412). Computer programs mayalso be received via a communication interface (424). Such computerprograms, when run, enable the computer system to perform the featuresof the present embodiments as discussed herein. In particular, thecomputer programs, when run, enable the processor (402) to perform thefeatures of the computer system. Accordingly, such computer programsrepresent controllers of the computer system.

The flowchart(s) and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods and computer program products according to variousembodiments. In this regard, each block in the flowchart or blockdiagrams may represent a module, segment, or portion of code, whichcomprises one or more executable instructions for implementing thespecified logical function(s). It should also be noted that, in somealternative implementations, the functions noted in the block may occurout of the order noted in the figures. For example, two blocks shown insuccession may, in fact, be executed substantially concurrently, or theblocks may sometimes be executed in the reverse order, depending uponthe functionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts, or combinations of special purpose hardware andcomputer instructions.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the embodiments.As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present embodiments has been presented for purposesof illustration and description, but is not intended to be exhaustive orlimited to the embodiments in the form disclosed.

Many modifications and variations will be apparent to those of ordinaryskill in the art without departing from the scope and spirit of theembodiments. The embodiment was chosen and described in order to bestexplain the principles of the embodiments and the practical application,and to enable others of ordinary skill in the art to understand theembodiments with various modifications as are suited to the particularuse contemplated.

It will be appreciated that, although specific embodiments have beendescribed herein for purposes of illustration, various modifications maybe made without departing from the spirit and scope of the embodiments.Accordingly, the scope of protection of the embodiments is limited onlyby the following claims and their equivalents.

What is claimed is:
 1. A method for quality control review of one ormore electronic modules comprising: performing a first test on a firstbatch of modules at a first location to detect a gross failureassociated with the modules, wherein each module includes a functionalassembly of electronic components, and re-directing modules determinedto have passed the first test from the first location to a secondlocation without further testing; performing a second test on failedmodules of the first test, wherein the second test is an electromagneticimaging test of one or more wires in the electronic module; andperforming a third test on modules that pass the second test, the thirdtest comprising an electronic current leakage screening comprising:performing a first instance of the third test on a module with a firstcurrent leakage setting; and performing a second instance of the thirdtest on the module with a second current leakage setting different fromthe first current leakage setting.
 2. The method of claim 1, whereinfailure of the second test indicates a wire sweep failure.
 3. The methodof claim 1, wherein the electromagnetic imaging test is an x-ray wiresweep test.
 4. The method of claim 2, wherein the wire sweep failure isa misalignment of one or more wires in the module.
 5. The method ofclaim 1, wherein the current leakage test employs a current leakagelimit.
 6. The method of claim 1, further comprising adjusting a settingof the current leakage with an increased leakage setting.
 7. The methodof claim 2, further comprising replacing a module with a wire sweepfailure with a replacement module selected from a population of modulesthat have not failed the screening for electronic current leakage.
 8. Acomputer program product for performing quality control review of one ormore electronic modules, the computer program product comprising acomputer readable hardware storage device having computer readableprogram code embodied therewith, the computer readable program code whenexecuted by a processor causing a system to: perform a first test on afirst batch of modules at a first location to detect a gross failureassociated with the modules, wherein each module includes a functionalassembly of electronic components, and re-direct modules determined tohave passed the first test from the first location to a second locationwithout further testing; perform a second test on failed modules of thefirst test, wherein the second test is an electromagnetic imaging testof one or more wires in the electronic module; and perform a third teston modules that pass the second test, the third test comprising anelectronic current leakage screening, the third test comprising: a firstinstance of the third test performed on a module with a first currentleakage setting; and a second instance of the third test performed onthe module with a second current leakage setting different from thefirst current leakage setting.
 9. The computer program product of claim8, wherein failure of the second test indicates a wire sweep failure.10. The computer program product of claim 8, wherein the electromagneticimaging test is an x-ray wire sweep test.
 11. The computer programproduct of claim 9, wherein the wire sweep failure is a misalignment ofone or more wires in the module.
 12. The computer program product ofclaim 8, wherein the current leakage test employs a current leakagelimit.
 13. The computer program product of claim 8, further comprisingcomputer readable program code when executed by a processor causing asystem to adjust a setting of the current leakage with an increasedleakage setting.
 14. The computer program product of claim 9, furthercomprising computer readable program code when executed by a processorcausing a system to replace a module with a wire sweep failure with areplacement module selected from a population of modules that have notfailed the screening for electronic current leakage.
 15. A system forperforming quality control review of one or more electronic modulescomprising: a processing unit in communication with memory; tools toperform quality control review for one or more electronic modules in abatch, wherein each module includes a functional assembly of electroniccomponents, the tools comprising: a test manager to: perform a firsttest on a first batch of modules at a first location to detect a grossfailure associated with the modules, wherein each module includes afunctional assembly of electronic components, and re-directing modulesdetermined to have passed the first test from the first location to asecond location without further testing; and perform a second test onfailed modules of the first test, wherein the second test is anelectromagnetic imaging test of one or more wires in the electronicmodule; and a screening manager to perform a third test on modules thatpass the second test, the third test comprising an electronic currentleakage screening comprising: a first instance of the third test to beperformed on a module with a first current leakage setting; and a secondinstance of the third test to be performed on the module with a secondcurrent leakage setting different from the first current leakagesetting.
 16. The system of claim 15, wherein failure of the second testindicates a wire sweep failure.
 17. The system of claim 16, wherein thewire sweep failure is a misalignment of one or more wires in the module.18. The system of claim 15, wherein the current leakage test employs acurrent leakage limit.
 19. The system of claim 15, further comprisingthe screening manager to adjust a setting of the current leakage with anincreased leakage setting.
 20. The system of claim 16, furthercomprising the screening manager to replace a module with a wire sweepfailure with a replacement module selected from a population of modulesthat have not failed the screening for electronic current leakage.